IC载板载体铜箔剥离机在IC载板制造工序中，自动撕除panel表面的CarrierCopperFoil的设备。
可适应InLine或OffLine。
在产品垂直的状态下撕除保护铜箔，构造上防止resin导致的二次污染，铜箔会进行单独回收。
UsedinthePCBmanufacturingprocess,thisequipmentwilldetachtheCarrierCopperFoilautomatically.ItisfeasibletosettheequipmentInlineandOffline.DetachtheCarrierCopperFoilverticallyandpreventthepanelfromsecondaryresinpollution,andtheCarrierCopperFoilwillbecollectedautomatically. DCDS200/DCDS300设备规格Productsize(mm)415mm(W)*510mm(L)[MODEL:DCDS200]510mm(W)*610mm(L)[MODEL:DCDS300]Productthickness(mm)CarrierFoil:12/12,18/18,Core:0.03~0.4mmTacttime22sec[MODEL:DCDS200]Tacttime25sec[MODEL:DCDS300]FacilitystructureL/UN,Separatorunit   Alarm,Safety Towerlamp,Emergencyswitch,DoorlockUtilityElectric:3phase220V,50/60Hz,AirPressure:5~6Kgf/Facilitysize2,100mm(W)*5,720mm(L)*2,760mm(H)[MODEL:DCDS200]2,300mm(W)*5,920mm(L)*2,860mm(H)[MODEL:DCDS 300]重量Loader-1200Kg(1300kg)Separator-1400Kg(1500kg)Unloader-1000Kg(1100kg)标签：封装基板铜箔剥离core 封装基板铜箔剥离机铜箔剥离机coreless铜箔剥离 深圳市载板铜箔剥离机 深圳市载板铜箔剥离机厂家广东深圳市[封装基板铜箔剥离机 铜箔剥离机 coreless铜箔剥离] 深圳市载板铜箔剥离机厂家IC载板铜箔剥离机