IC载板载体铜箔剥离机在IC载板制造工序中，自动撕除panel表面的Carrier Copper Foil的设备。
可适应In Line或Off Line。
在产品垂直的状态下撕 除保护铜箔，构造上防止resin导致的二次污染，铜箔会进行单独回收。
Used in the PCB manufacturing process, this equipment will detach the Carrier Copper Foil automatically. It is feasible to set the equipment In line and Off line. Detach the Carrier Copper Foil vertically and prevent the panel from secondary resin pollution, and the Carrier Copper Foil will be collected automatically.  DCDS 200 / DCDS 300 设备规格 Product size(mm) 415mm(W) * 510mm(L) [ MODEL: DCDS 200 ] 510mm(W) * 610mm(L) [ MODEL: DCDS 300 ] Product thickness(mm) Carrier Foil : 12/12, 18/18, Core : 0.03~0.4mm Tact time 22sec [ MODEL: DCDS 200 ] Tact time 25sec [ MODEL: DCDS 300 ] Facility structure L/UN, Separator unit    Alarm, Safety  Tower lamp, Emergency switch, Door lock Utility Electric: 3phase 220V, 50/60Hz, Air Pressure: 5~6Kgf/ Facility size 2,100mm(W) * 5,720mm(L) * 2,760mm(H) [ MODEL: DCDS 200 ] 2,300mm(W) * 5,920mm(L) * 2,860mm(H) [ MODEL: DCDS 300 ] 重量 Loader - 1200Kg (1300 kg) Separator - 1400Kg (1500 kg) Unloader - 1000Kg (1100 kg) 标签： 封装基板 铜箔剥离 core   封装基板铜箔剥离机 铜箔剥离机 coreless铜箔剥离   深圳市载板铜箔剥离机   深圳市载板铜箔剥离机厂家

广东 深圳市[封装基板铜箔剥离机 铜箔剥离机 coreless铜箔剥离] 深圳市载板铜箔剥离机厂家
IC载板铜箔剥离机